CXMT starts mass production with higher-density DRAM process
SemiconductorsUnverifiedUpdated:
CXMT says its new DRAM process can yield twice as many memory dies from a wafer, marking a claimed move from process development to mass production.
Claimed mass production on a fifth-generation process
CXMT announced that it has started mass production of chips made with its fifth-generation DRAM process.
The company says the process uses a high-k dielectric metal gate approach—an insulating technique intended to improve silicon efficiency—adapted for DRAM, or dynamic random-access memory. It says the process effectively doubles memory density and is represented by two 24GB LPDDR5X modules for smartphones and other high-end consumer electronics.
The announcement concerns chip production using CXMT’s fifth-generation DRAM process.
CXMT says it has begun mass production using a fifth-generation DRAM process that effectively doubles memory density.
Claims about density and supply capacity
If accurate, the shift to mass production would represent a material increase in CXMT's claimed ability to make denser DRAM chips. The report notes that more memory dies from each wafer could matter to electronics makers facing constrained and costly memory supplies.
Sources
- The RegisterChinese memory-maker CXMT claims DRAM production breakthroughRead source →