Reported $2B deal would add TSMC silicon-interposer production at GlobalFoundries’ New York fab
SemiconductorsUnverifiedUpdated:
A reported multi-year, $2 billion agreement would have GlobalFoundries make silicon interposers for TSMC at its Malta, New York fab—an advanced-packaging component used in multi-die chips such as GPUs and AI accelerators.
Planned CoWoS component production at the Malta fab
The Register reported that GlobalFoundries announced a $2 billion partnership with TSMC. Under the reported multi-year deal, GlobalFoundries would produce silicon interposers for TSMC’s chip-on-wafer-on-substrate (CoWoS) packaging specification at its Malta fab. Silicon interposers are components placed beneath compute logic and memory to link chips in multi-die assemblies.
The report does not establish prior GlobalFoundries production of these interposers. It says TSMC and Amkor have separate US advanced-packaging facilities expected to come online in 2028 and 2029, respectively.
The reported agreement would add planned GlobalFoundries capacity in Malta for TSMC silicon interposers, with volume production no earlier than the first half of 2028.
Volume production no earlier than 2028
Interposers are used in many high-bandwidth-memory chip assemblies, including GPUs and AI accelerators. The reported plan concerns a US-based element of advanced packaging, while its stated volume-production timeline remains no earlier than 2028.
Sources
- The RegisterTSMC taps GlobalFoundries to bolster US silicon interposer production in $2B dealRead source →